TY  - DATA
AU  - Lu, Daniel., editor.
TI  - Materials for Advanced Packaging
SN  - 9780387782195, 978-0-387-78219-5
U1  - 620.11295, 
PY  - 2009///
CY  - Boston, MA
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation
KW  - Electronics
KW  - Materials
KW  - Materials Science
KW  - Metallic Materials
KW  - Nanotechnology
KW  - Optical and Electronic Materials
KW  - Optical materials
N1  - Chemistry and Materials Science (Springer-11644)
UR  - http://dx.doi.org/10.1007/978-0-387-78219-5
ER  -